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Taking into account heat transfer due to conduction and convection, TEA Thermal users can analyze the stationary thermal behavior of 3D structures from CATIA V5 environment. They can easily obtain the temperature distribution. A variety of boundary conditions is available, from imposed temperature to imposed flux or convection coefficient and fluid temperature.
TEA Thermal allows Designers and Thermal Engineers to benefit from the generative and associative characters of CATIA V5 to predict easily the thermal performances of their products, directly from within their familiar CATIA V5 environment. Using TEA Thermal, CATIA V5 designers are able to quickly generate thermal models by adding specific features to an existing linear model built with CATIA V5 (GPS).
With the new thermal module of Transparent Extended Analysis (T.E.A.), SAMTECH allows significant costs reduction of design activities. After having released the first version of TEA Mecano in November 2002, at the European CATIA Forum, SAMTECH enables now CATIA V5 users to perform advanced thermal simulations analysis thanks to TEA Thermal.
With TEA Thermal, SAMTECH extends thus the V5 suite of SAMTECH analysis solutions embedded in CATIA V5 and provides CATIA V5 users with an easy access to thermal stationary analysis in addition to non-linear mechanical simulations (non-linear structures + contact) within the standard CATIA V5 environment. | 
